We offer advanced, high performing, no-compromise wafer fabrication solutions that enable semiconductor manufacturers to increase productivity and reduce manufacturing costs.

The first product on our technology roadmap is the Primo D-RIE™ dielectric Etch system. Built for 300-mm production of devices at 65-45 nm and beyond, the Primo D-RIE tool features proprietary technical innovations for higher throughput and superior on-wafer performance. Unique to this tool is a novel mini-batch cluster architecture that improves productivity by more than 35% over comparative systems, while offering a 35% lower cost-of-ownership (CoO) benefit. It carries the AMEC promise of simple design, superior performance, ease-of-use, reliability and affordability.

Our technology roadmap also includes development of the Primo HPCVD™ dielectric chemical vapor deposition (CVD) system.